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专利名称：Electronic device provided with an
encapsulation structure with improvedelectric accessibility and method ofmanufacturing the electronic device
发明人：Fabio Vito Coppone,Agatino
Minotti,Francesco Salamone
申请号：US14870721申请日：20150930公开号：US09570380B2公开日：20170214
专利附图：
摘要：An electronic device comprising: a semiconductor die integrating an electroniccomponent; a leadframe housing the semiconductor die; a protection body, whichsurrounds laterally and at the top the semiconductor die and, at least in part, theleadframe structure, defining a top surface, a bottom surface, and a thickness of theelectronic device; and a conductive lead electrically coupled to the semiconductor die.The conductive lead is modelled in such a way as to extend throughout the thickness ofthe protection body for forming a front electrical contact accessible from the top surfaceof the electronic device, and a rear electrical contact accessible from the bottom surfaceof the electronic device.
申请人：STMICROELECTRONICS S.R.L.
地址：Agrate Brianza IT
国籍：IT
代理机构：Seed Intellectual Property Law Group LLP
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