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专利名称：Signal communication structures
发明人：Kah Phang Loh,Pheng Yam Ng,Sin Heng Lim申请号：US10233125申请日：20020830公开号：US06762472B2公开日：20040713
专利附图：
摘要：Signal communication structures and methods for making the same areprovided. One embodiment of the present invention comprises a signal communicationstructure. The structure comprises a signal communication element having a signalcommunication surface, an integrated circuit chip, and a substrate. A surface of the signal
communication element other than the signal communication surface is physicallycoupled to a surface of the integrated circuit chip. In addition, another surface of theintegrated circuit chip is communicatively coupled to the substrate. Furthermore, the sizeof the signal communication surface is greater than the size of the surface of theintegrated circuit chip to which the signal communication element is physically coupled.
申请人：AGILENT TECHNOLOGIES, INC.
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