专利内容由知识产权出版社提供
专利名称：Relieved component pad for 0201 use
between vias
发明人：Alex L. Chan,Paul J. Brown申请号：US14941327申请日：20151113公开号：US09769925B2公开日：20170919
专利附图：
摘要：A relieved component pad for 0201 component use between vias on a tight-pitch Ball Grid Array is disclosed herein. The relieved component pad for 0201
component use between vias provides substantially rectangular component pads having
a relieved section at a point of closest approach to a via pad. The relieved componentpad for 0201 component use is particularly useful for overcoming the problem of 0201component placement on tight-pitch arrays known in the art.
申请人：ALCATEL-LUCENT CANADA INC.
地址：Ottawa CA
国籍：CA
代理机构：Kramer & Amado, P.C.
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